Gold Plating Thickness and Soldering Reliability of Solder Balls for Electroless Gold Plated TAB Tape Carrier.
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چکیده
منابع مشابه
The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIGplated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad sur...
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Gold embrittlement of solder joints has been written about for at least four decades [1 – 3]. Nevertheless, gold embrittlement related solder joint failures have been analyzed in this laboratory as recently as July 2009. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. The purpose of this paper is to provide a detailed account of ma...
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J. Bagger, ' V. Barger, K. Cheung, J. Gunion, T. Han, ' G. A. Ladinsky, R. Rosenfeld, and C.-P. Yuan Department ofPhysics and Astronomy, The Johns Hopkins University, Baltimore, Maryland 21218 Department ofPhysics, Uniuersity of Wisconsin, Madison, Wisconsin 53706 Department ofPhysics, Northwestern University, Euanston, Illinois 60208 Dauis Institute for High Energy Physics, Department ofPhysic...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2000
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.3.308